By Krishnendu Chakrabarty, Visit Amazon's Philip Y. Paik Page, search results, Learn about Author Central, Philip Y. Paik, , Vamsee K. Pamula
Due to expanding energy intake and part density, localized "hot spots" have gotten a major problem in IC (integrated circuit) chip layout - so critical, in reality, that Intel lately needed to yank a circuit since it used to be actually burning. For IC engineers grappling with excessive strength dissipation and thermal matters, new droplet-based cooling thoughts utilizing electronic microfluidics expertise may provide the answer. This definitive advisor paves the best way, with layout and implementation methodologies and prototypes for using this groundbreaking know-how. After reviewing cooling rules and present bulk cooling equipment, the ebook brings engineers in control on rising droplet-based architectures. Amply illustrated, this milestone paintings will turn out helpful in tackling IC warmth concerns that present tools can now not deal with.
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Additional resources for Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
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We begin our discussion of our digital microfluidic-based hot-spot cooling concept with the principles of actuating droplets using electrowetting. Since droplets in chip cooling applications are subject to a wide range of temperatures, we start by studying the contact lines of the droplets during motion, as they can be affected by thermal imbalances within the droplet. 1 Electrowetting-Based Actuation of Droplets The motion of droplets by the use of electrowetting is based on the principle of differences between contact angles in the advancing and receding lines of a droplet.
S. Kim, K. Flautner, D. Blaauw, and T. Mudge. ” Proceedings of the 35th Annual ACM/IEEE International Symposium on Microarchitecture. IEEE Computer Society Press, 219–230, 2002.  S. Kaxiras, Z. Hu, and M. Martonosi. ” Proceedings of the 28th Annual International Symposium on Computer Architecture. ACM Press, 240–251, 2001. 1 INTRODUCTION In Chapter 1, we discussed the challenges that design engineers face in addressing effective thermal management of ICs. While various techniques have been explored to reduce power consumption and therefore heat dissipation in ICs [1, 2], power consumption for these ICs continues to increase.
Adaptive Cooling of Integrated Circuits Using Digital Microfluidics by Krishnendu Chakrabarty, Visit Amazon's Philip Y. Paik Page, search results, Learn about Author Central, Philip Y. Paik, , Vamsee K. Pamula