Download e-book for iPad: Adhesive Chemistry: Developments and Trends by Lieng-Huang Lee (auth.), Lieng-Huang Lee (eds.)

Download e-book for iPad: Adhesive Chemistry: Developments and Trends by Lieng-Huang Lee (auth.), Lieng-Huang Lee (eds.)

By Lieng-Huang Lee (auth.), Lieng-Huang Lee (eds.)

ISBN-10: 1461294819

ISBN-13: 9781461294818

ISBN-10: 1461324351

ISBN-13: 9781461324355

Since the 1st symposium on fresh Advances in Adhesion, held September, 1971 in Washington, D. C. , this department of the yankee Chemical Society has regularly subsidized a number of symposia on adhesion and adhesives. The chemists have progressively discovered the significance of adhesion in quite a few fields of technology and know-how. in the course of those years, the technological know-how of adhesion has progressively grown besides growth in floor technology and fracture mechanics. additionally, new adhesives were invented and utilized in real constructions, for instance, structural and aerospace adhesives. in line with socio-economic calls for, new kinds of adhesives were brought to wrestle the issues of pollutants and to advertise energy-conservation. The advancements of hot-melt adhesives, waterborne adhesives, and radiation-curable adhesives are vibrant examples of successes in fixing many of the difficulties. As chemists, our hatural hope is to appreciate how these new adhesives and new different types of adhesives are made. hence, we're attracted to studying in regards to the chemistry of adhesives in order that we may possibly create new generations of fabrics to fulfill destiny wishes. It was once in keeping with this universal curiosity that w~ set forth to org'anize this Symposium on fresh advancements in Adhesive Chemistry. It used to be held from March 21 via 23, 1983 within the Westin inn, Seattle, Washington. The Symposium used to be rather well attended. in fact, for the 1st periods, we needed to movement from the smaller Mt. St.

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Extra resources for Adhesive Chemistry: Developments and Trends

Sample text

LEE Epoxy Resins Waterborne epoxy resin (99) has been used for lamination. The epoxy copolymers PD-6049 and PD-4070 are supplied by Celanese at 69% solids in glycol ether cosolvents, which can readily be dispersed with water. When the dispersion is formulated with an aminoplast catalyst, curing takes place in several seconds at 450 0 F (232 0 C). The dispersion has excellent adhesion to paper, PET film, and aluminum foil. As wood adhesives, isocyanates have found applications as binders for composition board (100).

Chu, "Viscoelastic Properties of Rubber-Resin Pressure Sensitive Adhesive Formulations," in Ref. 14. 31. Y. Hazony, S. J. Stadnicki, J. K. Gillham, "Low Frequency Thermomechanical Spectrometry of Polymer ic Materials: Computerized Torsional Braid Experiments. I. 2. 2, 549 (1974). 32. W. Alex Lee and M. J. Oliver, "Study of Cure of Epoxy Resins by Torsional Braid Analysis," Brit. Polym. J. , 40 (1983). 33. R. L. Levy and D. P. Ames, "Monitoring Epoxy Cure Kinetics with a Viscosity-Dependent Fluorescence Probe," in Ref.

33. R. L. Levy and D. P. Ames, "Monitoring Epoxy Cure Kinetics with a Viscosity-Dependent Fluorescence Probe," in Ref. 14. 34. J. T. Dickinson, "Fracto-Emission Adhesive Failure,n in Ref. 14. Accompanying 35. Y. Nakano, nPhotosensitive Adhesives and Sealants," Adhesives Age, 16, No. 12, 28 (1973). 36. K. C. Stueben, "Radiation Curing of PressureSensitive Adhesives: It. 5, 16 (1977). -H. LEE 54 37. K. C. Stueben, "Ultraviolet Cured Pressure Sensitive Adhesives," in Ref. 14. 38. V. D. McGinness, "Polymer and Formulation Design Characteristics for Developing Adhesive Bonding Radiation-Curable Systems," in Ref.

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Adhesive Chemistry: Developments and Trends by Lieng-Huang Lee (auth.), Lieng-Huang Lee (eds.)


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