By Daizhong Su, Qingbin Zhang, Shifan Zhu
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Extra info for Advanced design and manufacture II
The reliability performance of IC package during drop impact has become a great concern. The mechanical shock resulted from mishandling during transportation or customer usage may cause solder joint failure which leads to malfunction of products. More attention and effort have been devoted toward on mechanical modeling of microelectronic packages under impact loads. Lim and Low examined the impact response of cellular phones at different impact orientations and heights. Suhir developed simple models for the evaluation of the dynamic response of a structural element to an impact load during drop or shock test.
5 show the finite element meshes of PCB, drop table and the target, respectively. For the boundary conditions, all the nodes of the ground in the four half-spheres are fixed. The nodes along the clamped edges of the PCB were merged to the nodes on the fixture as fixed constraints. 2. 35, and 1520 kg / m 3 , respectively. The Young’s modulus of the Teflon may be varied in a wide range. 1GPa. 3 and density 7860kg / m 3 is dropped from a height of 50mm onto the four half-spheres. 6. It shows large difference between the numerical calculation and experimental measurement.
1453-1478. tw Keywords: Coke oven, Numerical simulation, Thermoelectric cooler Abstract. In order to inspect on wall condition inside the coke oven, an inspection device has been developed to protect a camera inside and sustains high temperature long enough so that it can be permanently-installed on the pusher ram beam. The temperature of the coking chamber during operation is about 1200 C while the maximum tolerable temperature of a camera is less than 40 C. The device has to function as a good thermal insulator with cooling element for the camera at the pusher head and for signal cables along the beam.
Advanced design and manufacture II by Daizhong Su, Qingbin Zhang, Shifan Zhu